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  • Products Name: Excellent Ⅱ 355 UV Series Pulse Solid Laser
  • Products NO.: Excellent Ⅱ 355

ExcellentⅡ355 UV series DPSS lasers include 8.0W to 10.0W models. With relatively short pulse width (<20ns@50K), superior beam quality(M2<1.2)and perfect beam spot quality (Beam Circularity>90% ). This series lasers are widely used in precisely marking on nonmetal materials, LED etching, glass marking and FPC cutting applications.

Main characteristics:
1.Laser wavelength 354.7nm. Repetition rates cover a wide range (single pulse to 200 kHz).
2.Short pulse width (<20ns@50K), small thermal effect on operation field.
3.Superior beam quality (M2<1.2), absolutely assured in all repetition rates.
4.ORHAC (online refreshment for harmonic coupling) technology, long term power stability.
5.Unique Q-switching technology, adapts a variety of control requirements of laser applications.
6.Whole process intelligent digital power control technology, which can control lasers through RS232 external controller.
7.Industrial production process control technology, provides quality stable products.

 

Excellent 355 Series Parameter Unit Description
Laser wavelength 354.7 nm  
Average Output Power 1 8.0-10.0 W @30kHz
Pulse Width 1 <20 ns @30kHz
Pulse Repetition Rate 10-120 kHz  
Spatial Mode TEMoo    
M2 <1.2    
Beam Diameter 2.5+/-0.2 mm  Measured from window
Beam Full Divergence Angle <0.5 mrad  
Beam Circularity >0.90    
Pulse-to-Pulse Stability <3 % RMS/@40kHz
Average Power Stability <5 % RMS/8hr
Beam-Pointing Drift 2 <25 μrad/℃  
Polarization Ratio >100:1    
Polarization Orientation Horizontal    
Operating Temp. & RH 10 to 30
<80

%
 
Storage Temp. & RH -20 to 65
<90

%
 
Electricity Requirement
Power Consumption

100-240
50/60
<800

VAC
Hz
W
Single phase
Warranty 12 months  
1.Laser power and other characteristics can be optimized in different repetition rates.
2.The temperature referred is ambient temperature.

      Laser Head:


 

 

 
 

 

 Laser-Driver:

 

 

Chiller:

§ Glass scribing and marking

§ Millipore punching

§ removal of metal and non-metal coating

§ flexible PCB marking and scribing

§ material micromachining

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